球形度高 流动性好 分散性好 
 
振实密度高 填充性好 粒径均匀 结晶度高 
 
 
 
Feature 
 
Good dispersion, Spherical shape, High degree of crystallinity, Good dispersion,
 
High tap density, Good fillibility,Good liquidity
 
 
 
用于制备导电浆料、HJT异质结浆料、导电印刷油墨、导电胶、薄膜开关等中低温料浆，可以代替银粉用于电子行业上。
 
 
 
    Application:
 
      Apply to conductive paste,HJT paste, conductive printing ink, conductive resin, membrane switch and other intermediate and low-temperature paste, which can be instead of silver powder used in electronic industry.
 
 
 
 
 
 
  
 
   
 
规格Specification 
 
 
   
 
平均粒径(μm) Mean Particle Size 
 
 
   
 
比表面积(m2/g)
 
Specific Surface Area 
 
 
   
 
粒度分布(μm)
 
Particle Size Distribution
 
 
   
 
银含量(wt%)
 
Ag Content 
 
 
  
 
  
 
   
 
D10 
 
 
   
 
D50 
 
 
   
 
D90 
 
 
  
 
  
 
   
 
CuAg-S0501 
 
 
   
 
0.8 
 
 
   
 
1.50-2.50 
 
 
   
 
≤1.00 
 
 
   
 
≤2.00 
 
 
   
 
≤4.00 
 
 
   
 
15-30 
 
 
  
 
  
 
   
 
CuAg-S1001 
 
 
   
 
2.0 
 
 
   
 
0.45-0.85 
 
 
   
 
≤2.50 
 
 
   
 
≤4.00 
 
 
   
 
≤5.50 
 
 
   
 
10-30 
 
 
  
 
  
 
   
 
CuAg-S3501 
 
 
   
 
3.0 
 
 
   
 
0.25-0.45 
 
 
   
 
≤3.80 
 
 
   
 
≤6.00 
 
 
   
 
≤9.30 
 
 
   
 
10-30 
 
 
  
 
  
 
   
 
CuAg-F0501 
 
 
   
 
- 
 
 
   
 
1.90-2.00 
 
 
   
 
≤1.70 
 
 
   
 
≤3.70 
 
 
   
 
≤5.60 
 
 
   
 
20-30 
 
 
  
 
  
 
   
 
CuAg-F1001 
 
 
   
 
- 
 
 
   
 
0.80-0.95 
 
 
   
 
≤3.20 
 
 
   
 
≤4.80 
 
 
   
 
≤6.30 
 
 
   
 
15-30 
 
 
  
 
  
 
   
 
CuAg-F3501 
 
 
   
 
- 
 
 
   
 
0.70-1.30 
 
 
   
 
≤3.80 
 
 
   
 
≤7.10 
 
 
   
 
≤10.30 
 
 
   
 
10-30 
 
 
  
 
 
 
 
Different specifications of products can be customized.
 
* T     tter ‘F’ in the specification means flake powder