打开包装之后,应在24hrs 内焊接完毕. After opening the package, The LEDs should be soldered within 24 hours (1days), they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). 下列情况发生时，须要在焊接前重新烘烤60 ± 5°C,24小时以上。 A．当包装袋破损漏气 B．打开包装后在24hrs内未焊接完毕 C．LED超过存储时间。. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions Baking treatment : more than 24 hours at 65 ± 5°C. 发热性Heat Generation 高温会降低产品的性能及可靠性,请远离发热源. High temperature reduces device performance &. 最终产品的散热设计是  重要的因素.系统设计时请考虑LED产生的热量.