LOAD LOCK Chamber (option)
 
LOAD LOCK预真空进样室（可选）
 
Chamber with front open door
 
前开门蒸发腔体
 
Cryopump and dry pump
 
冷凝泵和干泵
 
Multiple thermal evaporation sources   or OLED sources
 
多个热阻蒸发源或OLED低温蒸发源
 
Max. 6” substrate
 
6”基片
 
Substrate rotation
 
基片旋转
 
Substrate bias (option)
 
基片偏压（可选）
 
Ion source for substrate cleaning   (option)
 
离子源清洗基片（可选）
 
Substrate heating to 1000C (option)
 
基片加热1000度(可选)
 
Crystal rate monitor and film   thickness control
 
晶振沉积速率及膜厚控制
 
Manual or automatic system control
 
系统手动或自动控制
 
For deposition of metal, semiconductor   and insulation materials
 
可沉积金属、半导体和绝缘材料
 
For deposition of multi-layer or alloy   film
 
可沉积多层膜及合金薄膜