电流。  
 
 
 High current capability.  
 
 
 比片状电阻 低的电流噪音。  
 
 
 Lower current noise than flat chip resistors.  
 
 
 (pb)无铅且符合ROHS标准。  
 
 
 Lead(pb)-free and ROHS compliant .  
 
 
 锡铜镀层的,帽盖连接。  
 
 
 Force fitted steel caps,tin plated on copper barrier.  
 
 
 圆柱形设计，可自由安装于基板。 
 
Free direction for mounting due to cylindrical design.
 
 
 
 
  稳定性，薄膜技术。  
 
 
 
 
  Superior overall stabillity,most advanced thin film technology